CPU-AMD Ryzen9 7900 Box

Cores
12
Threads
24
Turbo Clock
5.40GHz
Base Clock
3.70GHz
TDP
65W
Graphics
yes (AMD Radeon Graphics)
Socket
AMD AM5 (LGA1718)
chipset suitability
B650, B650E, X670, X670E
Codename
Raphael
Architecture
Zen 4
Manufacturing Process
TSMC 5nm (CPU), TSMC 6nm (I/?O)
L2 cache
12MB (12x 1MB)
L3 cache
64MB (2x 32MB)
Memory controller
Dual Channel DDR5-5200 (PC5-41600), 51.2GB/?s, max. 128GB
ECC support
yes
SMT
yes
Remote management
no
Unlocked
yes
CPU-Features
AES-NI, AMD-V, AVX, AVX-512, AVX2, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4a, x86-64
Scalability
1 socket (1S)
PCIe Lanes
24x PCIe 5.0
chipset Interface
PCIe 4.0 x4
iGPU-Model
AMD Radeon Graphics
iGPU-Clock
0.40-2.20GHz
iGPU-Units
2CU /? 128 Shader
iGPU-Architecture
RDNA 2, Codename "Raphael"
iGPU Interface
DP 2.0, HDMI 2.1
iGPU-Features
4x display support, AMD Eyefinity, AMD FreeSync 2, AV1 decode, H.265 encode/?decode, VP9 encode/?decode, DirectX 12.1, OpenGL 4.5, Vulkan 1.0
iGPU processing Power
0.5632 TFLOPS (FP32)
Scope of Delivery
with CPU cooler (AMD Wraith Prism, WxHxD: 159x96x136mm)
Launch
2023/?Q1 (14.1.2023)
Segment
desktop (Mainstream)
Stepping
RPL-B2
Max Temperature
95°C (Tjmax)
Thermal Interface material
metal/?soldered